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News Stories

Taking the Heat Out of Stent Manufacturing - Industrial Laser Solutions

January 19, 2010





Heat is almost always the enemy.

This is particularly true as the scale on which we build things shrinks, whether stacked integrated circuits or implantable medical devices. In the microelectronics world, the challenge is to manage—through design and materials engineering—the heat generated after manufacturing, during device operation. In the realm of medical devices, that thermal management challenge shifts to the front end.